Partner with System Architects and engineering teams to define package architecture, connectivity, and electrical requirements . Develop block diagrams, schematics, and logical connectivity for system-in-package designs.
Lead cross-functional project development activities. Drive project execution across scope, schedule, quality, cost, and customer commitments while providing executive status updates.
Serve as the primary technical interface for assigned strategic customers. Engage customer architects and engineers across component, package, and system levels. Define customer problems and co-develop cross-domain technical solutions.
Define SI architectural strategies for high‑speed memory and system interfaces. Perform early feasibility and scaling analysis for future data rates. Build hands‑on channel models across package, board, and system.
MicronNew · 1d ago
Lead SI/PI architecture pathfinding for next-generation DRAM products across AI, data center, and client platforms. Define channel, package, board, and module-level SI/PI requirements and design targets for product development.
We are seeking a motivated engineer to join the DRAM Systems Engineering team, focusing on the development, evaluation, and optimization of next-generation memory systems for AI accelerators.
Deliver system architecture and technical direction for UFS, client SSD, and automotive SSD products throughout the product lifecycle.
Define and evolve ASIC and system architectures, including logic partitioning, module interfaces, and design tradeoffs across performance, power, area, and scalability.
The Legal Department at Micron is hiring an Assistant General Counsel, Ventures & M&A, based in San Jose, to join the Corporate Legal Team.
Define architectures for DDR, LPDDR, HBM, CXL-attached memory, and emerging memory technologies. Develop analytical and simulation-based models to evaluate performance, reliability, power, thermal, and cost tradeoffs.
Showing 11–20 of 193 jobs
Show more jobs
Boise, USA
Vimercate (MB), IT
Munich (MDC), DE