Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs.
As a Principal Software Engineer, you will design, develop, and deliver software and firmware for ultra-high-performance datacenter-scale solutions.
- Designing SOI high-power switches for 4G/5G smartphone integrated RF Front-End (RFFE) modules. - Developing antenna switches, band switches, and matching circuits on SOI dies and compact PCB layouts capable of handling high power.
This position involves working with the latest technology to continue driving next generation AI/ML ecosystems through our PCIe Switch Products – and managing mega datacenters, while leading world class performance, through our Enterprise Storage Products.
Principal Physical Design Engineer — ASIC Products Division (APD). Location: San Jose, CA. Position Type: Full-Time. Who We Are — Physical Design Team in APD.
Broadcom is looking for a lead STA/ Synthesis engineer.
Broadcom’s ASIC Products Division (APD) is looking for a motivated Physical Design Engineer (NCG) to join our Physical Design team.
Broadcom’s ASIC Products Division (APD) is looking for a Principal Physical Design Engineer to lead physical design implementation tasks for next-generation high-performance networking, AI/ML accelerators, and custom cloud ASICs.
At Broadcom, we shape the future of global technology by delivering world-class custom silicon and infrastructure solutions that power the largest hyperscale data centers and advanced AI platforms on earth.
Understanding Broadcom & customer DFT feature requirements & DPPM goals & defining appropriate DFT specifications for the ASIC. Implementing DFT, including Scan, MBIST, TAP, LBIST, IO, SerDes and other I/P DFT integration.
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