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Broadcom

Physical Design Engineer

  • USA-CA San Jose Innovation Drive, United States
  • Onsite
  • Posted 13d ago
  • Full-time

Salary

$144K - $230K

From the employer’s posting

Pays more than 44% of 22,225 six-figure listings in USD.

This job
$144k–$230k
Typical
$195k
Most pay
$160k–$240k
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Benefits

  • Equity
  • Bonus
  • Health insurance
  • 401(k)
  • Paid time off
  • Parental leave

Full job description

Description

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Physical Design Engineer (New College Grad) — ASIC Products Division (APD)

Location: San Jose, CA

Position Type: Full-Time

Who We Are — Physical Design Team in APD

Broadcom’s ASIC Products Division (APD) is the global leader in custom high-performance silicon solutions. We partner with the world’s most innovative technology companies—spanning hyper-scale cloud providers, AI pioneers, and tier-1 networking infrastructure leaders—to co-design and manufacture complex, custom ASICs that power the modern digital backbone.

The Physical Design team within APD is the world-class execution engine behind the industry's most advanced custom silicon. We push the limits of silicon technology by combining deep architectural expertise, advanced IP, cutting-edge physical design methodologies in 3nm/2nm/A14 nodes, and advanced 2.5D/3D chiplet integration to solve the most demanding compute and bandwidth challenges.We transform ultra-complex architectures into fully realized, high-yielding, first-pass silicon success.

What Defines Our Physical Design Team

  • Pioneering First-Pass Silicon in 3nm/2nm: Our team consistently pushes the boundary of physics, taking the largest and most complex die sizes from floorplan to tapeout on leading-edge foundry nodes (N7, N5, N3, and N2).
  • Record-Breaking Scale & Complexity: We regularly execute full-chip physical implementation for ultra-large-scale ASICs exceeding tens of billions of transistors, multi-gigahertz clock frequencies, and dense multi-die 2.5D/3D integration (CoWoS, HBM3/4, chiplet architectures).
  • Methodology & Flow Leadership: We develop and maintain cutting-edge in-house (AI Driven) automation and methodology across different EDA tools, setting the benchmark for signoff quality and turn-around-time (TAT).

About the Role

Broadcom’s ASIC Products Division (APD) is looking for a motivated Physical Design Engineer (NCG) to join our Physical Design team. In this role, you will work alongside experienced engineers in executing the  implementation tasks for next-generation high-performance networking, AI/ML accelerators, and custom cloud ASICs. In this role, you will gain hands-on experience in complex block-level floorplanning, synthesis, Place and Route (P&R), clock tree synthesis (CTS), timing closure, and signoff across cutting-edge deep sub-micron nodes (N5/N3/N2/A14).

Key Responsibilities

  • Participate in block-level floorplanning, and run placement and route (P&R) flows using industry-standard EDA tools.
  • Perform Static Timing Analysis (STA), debug timing paths, and execute ECOs for timing closure.
  • Run Physical Verification checks (DRC, LVS, ERC, Antenna) and resolve signoff violations.
  • Analyze IR drop and electromigration (EM) to ensure power grid integrity.
  • Develop and maintain automated scripts (TCL, Python, Ruby) to enhance flow efficiency and productivity

Requirements

Basic Qualifications

  • Education: Bachelor's Degree in Electrical Engineering, Computer Engineering + 2yrs of experience or Master’s degree in Electrical Engineering, Computer Engineering (Graduation date within the past 12 months).
  • Solid understanding of digital CMOS logic design, standard cell libraries, and semiconductor fundamentals.
  • Familiarity with static timing analysis (STA) concepts, clocking, and setup/hold timing.
  • Hands-on coursework, lab experience, or academic projects using EDA design tools (Cadence Innovus/Tempus, Synopsys IC Compiler II/PrimeTime, or Siemens tools).
  • Proficient in scripting languages such as TCL, Python, Ruby, or Bash.

Preferred Qualifications

  • Prior internship or research experience in ASIC physical design, synthesis, or physical verification.
  • Basic understanding of Design for Testability (DFT), low-power intent (UPF/CPF), and FinFET technologies.
  • Excellent problem-solving, debugging, and analytical skills.
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